Modeling and Model-Based Control for Chemical-Mechanical Planarization
Under this NSF sponsored Small Business Innovation Research (SBIR) Phase II project, SC Solutions proposed a product development effort for physical modeling and model-based sensing and control of chemical mechanical planarization (CMP) systems. CMP is a rapidly emerging technology playing an increasingly critical role in global planarization for microelectronics fabrication. In Phase I, SC demonstrated the feasibility of modeling and real-time control using actual experimental data from the Applied Materials’ MirraTM CMP system. The results of our 3D contact mechanical models correlate closely with experimental results for removal rate distribution across the wafer. Reduced input-output models relating the within wafer nonuniformity (WIWNU) to the pressure ratio and pad conditioning, obtained from the detailed 3D models, were used as a basis for real-time and run-to-run control. In Phase II, extended these models and control methods, and develop a model-based embedded controller for within-wafer and within-die uniformity control. The Phase II development effort culminated in the following products tested on the MirraTM system at Applied Materials: advanced process modeling and control software, and an embedded controller for CMP. The successful commercial application of our technology in the semiconductor industry is tremendous, resulting in improved and repeatable performance, increased throughput, and improved yields.